Mark Liao (Circ. & Sys. Society) Acad. Sinica, liao@iis.sinica.edu.tw
Yu-Hen Hu (Comm. Society) U. Wisconsin, US, hu@engr.wisc.edu
Philip Sheu (Comp. Society) UC Irvine, US, psheu@uci.edu
Joern Ostermann (Sig. Pr. Soc.) LUH, Germany, ostermann@tnt.uni-hannover.de
[Responsible Tech-Chair: Joern Ostermann]
Track Chairs:
Fernando Pereira, Instituto Superior T�cnico, Portugal, fp@lx.it.pt
Xiaolin Wu, McMaster University, Canada, xwu@ece.mcmaster.ca
Beatrice Pesquet-Popescu, Ecole Nationale Sup�rieure des T�l�communications, France, beatrice.pesquet@enst.fr
Susanto Rahardja, Institute for Infocomm Research, Singapore, rsusanto@i2r.a-star.edu.sg
Hongbin Zha, Beijing University, China, zha@cis.pku.edu.cn
[Responsible Tech-Chair: Mark Liao]
Track Chairs:
Tat-Seng Chua, National University of Singapore, Singapore, chuats@comp.nus.edu.sg
Fatih Porikli, MERL, US, fatih@merl.com
[Responsible Tech-Chair: Yu-Hen Hu]
Track Chairs:
Alan Hanjalic, Delft U., Netherland, A.Hanjalic@tudelft.nl
Chi-Ren Shyu, U. Missouri-Columbia, US, shyuc@missouri.edu
[Responsible Tech-Chair: Joern Ostermann]
Track Chairs:
Jin Li, Microsoft, US, jinl@microsoft.com
Torsten B�schenfeld, LUH, Germany, bfeld@tnt.uni-hannover.de
[Responsible Tech-Chair: Yun-Qing Shi]
Track Chair:
Qibin Sun, I2R, Singapore, qibin@i2r.a-star.edu.sg
[Responsible Tech-Chair: Yu-Hen Hu]
Track Chairs:
Jie Yang, CMU, US, jie.yang@cs.cmu.edu
Forouzan Golshani, Wright State University, US, golshani@wright.edu
[Responsible Tech-Chair: Philip Sheu]
Track Chairs:
Wan-Chi Fang, JPL, US, wai-chi.fang@jpl.nasa.gov
George Wang, CSUN, US, twang@csun.edu
Guoliang Fan, OSU, US, guoliang.fan@okstate.edu
John Aa. Sorenson, ECC, Denmark, jaas@ihk.dk
Shipeng Li, Microsoft Research Asia, China, Shipeng.Li@microsoft.com
Ming-Ting Sun, University of Washington, US, sun@ee.washington.edu
Oscar Au, HKUST, China, eeau@ust.hk
Jian Lu, Vobile, US, jian@computer.org
Feng Wu, Microsoft Research Asia, China, fengwu@microsoft.com
Enis Cetin, Bilkent University, Turkey, cetin@ee.bilkent.edu.tr
Nicola Adami, University of Brescia, Italy, nicola.adami@ing.unibs.it
Brett Adams, Curtin University of Technology, Australia, b.adams@curtin.edu.au
Ankur Agarwal, Florida Atlantic University, USA, ankur@cse.fau.edu
Lalitha Agnihotri, Philips Research, USA, lalitha@cs.columbia.edu
Emmanuel Agu, Worcester Polytechnic Institute, USA, emmanuel@cs.wpi.edu
Kiyoharu Aizawa, University of Tokyo, Japan, aizawa@hal.k.u-tokyo.ac.jp
Cuneyt Akinlar, Anadolu University, Turkey, cakinlar@anadolu.edu.tr
Houman Alborzi, Google, USA, houman@google.com
Dima Aliakseyeu, Eindhoven University of Technology, The Netherlands, d.aliakseyeu@tue.nl
Isabelle Amonou, FT RD, France, isabelle.amonou@orange-ftgroup.com
Rie Ando, IBM Watson Research Center, USA, rie1@us.ibm.com
Zafer Arican, EPFL, Switzerland, zafer.arican@epfl.ch
Joao Ascenso, ISEL - IT, Portugal, joao.ascenso@lx.it.pt
Pedro Assun��o, I.P. Leiria / I.T. Coimbra, Portugal, assuncao@estg.ipleiria.pt
Pradeep Atrey, University of Ottawa, Canada, patrey@site.uottawa.ca
Oscar Au, HKUST, Hong Kong, eeau@ust.hk
Yannis Avrithis, National Technical University of Athens, Greece, iavr@image.ntua.gr
Olufunmilola Awoniyi, Texas Instruments, USA, lawoniyi@ti.com
Mohammad Awrangjeb, Monash University, Australia, Mohammad.Awrangjeb@infotech.monash.edu.au
Ramazan Aygun, University of Alabama in Huntsville, USA, raygun@cs.uah.edu
Torsten B�schenfeld, Leibniz Universitaet Hannover, Germany, bfeld@tnt.uni-hannover.de
Noboru Babaguchi, Osaka University, Japan, babaguchi@comm.eng.osaka-u.ac.jp
Leonardo Bachega, Purdue University, USA, lbachega@purdue.edu
Andrew Bagdanov, University of Florence, Italy, bagdanov@dsi.unifi.it
Robert Ball, Virginia Polytechnic and State University, USA, rgb6@vt.edu
Saurav Bandyopadhyay, University at Buffalo, The State University of New York, USA, skb3@buffalo.edu
Mauro Barbieri, Philips Research, The Netherlands, mauro.barbieri@philips.com
John Barron, Univ. of Western Ontario, Canada, barron@csd.uwo.ca
Faisal Bashir, Retica Systems Inc, USA, fbashir@retica.com
Anup Basu, University of Alberta, Canada, anup@cs.ualberta.ca
Christian Becker, Leibniz Universit�t Hannover, Germany, becker@tnt.uni-hannover.de
Ali Begen, Cisco Systems, USA, acbegen@ece.gatech.edu
A. Beghdadi, Galilee University, France, beghdadi@galilee.univ-paris13.fr
Amel Benazza, SupCom Tunis, Tunisia, byahia@planet.tn
Rachid Benmokhtar, Eurecom Institute, France, Rachid.Benmokhtar@eurecom.fr
Stefano Berretti, University of Florence, Italy, berretti@dsi.unifi.it
Marco Bertini, Universit� di Firenze, Italy, bertini@dsi.unifi.it
Maik Bevermeier, University of Paderborn, Germany, bevermeier@nt.uni-paderborn.de
Sitaram Bhagavathy, Univ. of California, Santa Barbara, USA, sitaram@ece.ucsb.edu
Prabir Bhattacharya, Concordia University, Canada, prabir@ciise.concordia.ca
Ghulam Bhatti, MERL, USA, gbhatti@merl.com
Guoan Bi, Nanyang Technological University, Singapore, EGBI@NTU.EDU.SG
Alian Biem, IBM Research, USA, biem@us.ibm.com
Chris Bleakley, University College Dublin, Ireland, chris.bleakley@ucd.ie
Guillaume Boisson, Thomson, France, guillaume.boisson@thomson.net
Susanne Boll, University of Oldenburg, Germany, susanne.boll@informatik.uni-oldenburg.de
Johan Bollen, Los Alamos National Laboratory, USA, jbollen@lanl.gov
Olivier Bonaventure, Universit� catholique de Louvain, Belgium, Olivier.Bonaventure@uclouvain.be
Jean-Marie Bonnin, ENST Bretagne, France, jm.bonnin@enst-bretagne.fr
Nozha Boujemaa, INRIA, France, nozha.boujemaa@inria.fr
Christos Bouras, University of Patras, Greece, bouras@ceid.upatras.gr
Herve Bourlard, IDIAP, Switzerland, bourlard@idiap.ch
Patrick Bouthemy, IRISA/INRIA, France, patrick.bouthemy@irisa.fr
Emmanuel Boutillon, University of South Britany, France, emmanuel.boutillon@univ-ubs.fr
Jill Boyce, Thomson Inc., USA, jill.boyce@thomson.net
Tom�s Brand�o, ISCTE-IT, Portugal, tomas.brandao@lx.it.pt
Gordon Braudaway, IBM Research, USA, braud@us.ibm.com
Catarina Brites, IST - IT, Portugal, catarina.brites@lx.it.pt
Alfred Bruckstein, Technion, Israel, freddy@cs.technion.ac.il
Paolo Bucciol, Politecnico di Torino, Italy, paolo.bucciol@polito.it
Vasile Buzuloiu, Polytechnic Institute Bucharest, Romania, buzuloiu@alpha.imag.pub.ro
Marco Cagnazzo, University of Napoli, Italy, cagnazzo@unina.it
Jianfei Cai, Nanyang Technological University, Singapore, asjfcai@ntu.edu.sg
Janko Calic, University of Bristol, United Kingdom, janko@cs.bris.ac.uk
K. Selcuk Candan, Arizona State University, USA, candan@asu.edu
Lei Cao, The University of Mississippi, USA, lcao@olemiss.edu
David Capson, McMaster University, Canada, capson@mcmaster.ca
Simon Carlile, University of Sydney, Australia, simon.carlile@bosch.org.au
Elias S.G. Carotti, Politecnico di Torino, Italy, carotti@polito.it
Vittorio Castelli, IBM, USA, vittorio@us.ibm.com
Andrea Cavallaro, Queen Mary, University of London, United Kingdom, andrea.cavallaro@elec.qmul.ac.uk
Jorge Caviedes, Intel Corporation, USA, jorge.e.caviedes@intel.com
Fran�ois Cayre, Institut National Polytechnique de Grenoble, France, cayre@lis.inpg.fr
Byungho Cha, University of Southern California, USA, byungcha@usc.edu
Sung-Hyuk Cha, Pace University, USA, scha@pace.edu
Rong Chai, McMaster University, Canada, chair@grads.ece.mcmaster.ca
Lekha Chaisorn, Institute for Infocomm Research, Singapore, Singapore, clekha@i2r.a-star.edu.sg
Chris Chambers, Portland State University, USA, chambers@cs.pdx.edu
Carri Chan, Stanford University, USA, cwchan@stanford.edu
Hock C Chan, National University of Singapore, Singapore, chanhc@comp.nus.edu.sg
Damon Chandler, Oklahoma State University, USA, damon.chandler@okstate.edu
Bin Chang, Vanderbilt University, USA, bin.chang@vanderbilt.edu
Chin-Chen Chang, Feng Chia University, Taiwan, ccc@cs.ccu.edu.tw
Gui-Ran Chang, Northeastern University, P.R. China, chang@neu.edu.cn
Hsuan-Ting Chang, National Yunlin University of Science and Technology, Taiwan, htchang@yuntech.edu.tw
Sukmoon Chang, Penn State Unviersity, USA, sukmoon@psu.edu
Lap-Pui Chau, Nanyang Technological University, Singapore, elpchau@ntu.edu.sg
Yi-Min Chee, IBM Research, USA, ymchee@us.ibm.com
Lee Chee Mun, Institute for Infocomm Research, Singapore, cmklee@i2r.a-star.edu.sg
Rama Chellappa, Univ. of Maryland, USA, rama@cfar.umd.edu
Chang Wen Chen, Florida Institute of Technology, USA, cchen@fit.edu
Chaur-Chin Chen, National Tsing Hua University, Taiwan, cchen@cs.nthu.edu.tw
Cheng Chen, Oklahoma State University, USA, c.chen@okstate.edu
Chunhua Chen, New Jersey Institute of Technology, USA, cc86@njit.edu
Chu-Song Chen, Institute of Information Science, Academia Sinica, Taiwan, Taiwan, song@iis.sinica.edu.tw
Datong Chen, Carnegie Mellon University, USA, datong@cs.cmu.edu
Jianfeng Chen, Institute for Infocomm Research, Singapore, jfchen@i2r.a-star.edu.sg
Ling-Jyh Chen, Academia Sinica, Taiwan, cclljj@iis.sinica.edu.tw
Mei Chen, Intel Research Pittsburgh, USA, mei.chen@intel.com
Mei-Juan Chen, National Dong-Hwa University, Taiwan, cmj@mail.ndhu.edu.tw
Min Chen, University of British Columbia, Canada, minchen@ece.ubc.ca
Minghua Chen, Microsoft Research, USA, minghuac@microsoft.com
Ming-Syan Chen, National Taiwan University, Taiwan, mschen@cc.ee.ntu.edu.tw
Mingyu Chen, Carnegie Mellon University, USA, mychen@cs.cmu.edu
OScal T.-C. Chen, National Chung Cheng University, Taiwan, oscal@ee.ccu.edu.tw
Qing Chen, North China Electric Power University, P.R. China, q_chen05@163.com
Qing Chen, Univ. of Shanghai, P.R. China, qchen418@yahoo.com
Sau-Gee Chen, National Chiao Tung University, Taiwan, sgchen@cc.nctu.edu.tw
Sei-Wang Chen, National Taiwan Normal University, P.R. China, schen@csie.ntnu.edu.tw
SY Chen, Yuan-Ze University, Taiwan, cschen@saturn.yzu.edu.tw
Tao Chen, Sarnoff Corporation, USA, taochen@ieee.org
Trista Chen, FX Palo Alto Laboratory, USA, tchen@fxpal.com
Tsuhan Chen, CMU, USA, tsuhan@cmu.edu
Wen Chen, New Jersey Institute of Technology, USA, wc47@njit.edu
Wenliang Chen, , Japan, chenwenliang@gmail.com
Yen-Kuang Chen, Intel Corporation, USA, yen-kuang.chen@intel.com
Yuan Chen, Huazhong Univ of Sci & Tech, P.R. China, ychen@smail.hust.edu.cn
Yung-Chang Chen, National Tsing Hua University, Taiwan, ycchen@ee.nthu.edu.tw
Corey Cheng, Dolby Laboratories, USA, coreyicheng@gmail.com
Hong Cheng, Carnegie Mellon University, USA, hongc@cs.cmu.edu
Irene Cheng, University of Alberta, Canada, lin@cs.ualberta.ca
Jian Cheng, Chinese Academy of Sciences, P.R. China, jcheng@nlpr.ia.ac.cn
Qi Cheng, Oklahoma State University, USA, qi.cheng@okstate.edu
Gene Cheung, HP Labs, Japan, gene-cs.cheung@hp.com
Liang-Tien Chia, Nanyang Technological University, Singapore, asltchia@ntu.edu.sg
Shao-Yi Chien, National Taiwan University, Taiwan, sychien@cc.ee.ntu.edu.tw
Tuan Kiang Chiew, Institute for Infocomm Research, Singapore, chiewtk@i2r.a-star.edu.sg
Patrick Chiu, Fuji-Xerox Palo Alto Laboratory, USA, chiu@fxpal.com
Namgook Cho, University of Southern California, USA, namgookc@usc.edu
SaeHong Cho, Hansung University, Korea, chosh@hansung.ac.kr
Jike Chong, University of California, Berkeley, USA, jike@eecs.berkeley.edu
Kok Seng Chong, Panasonic Laboratories Singapore, Singapore, KokSeng.Chong@sg.panasonic.com
Sayantan Choudhury, University of California, Santa Barbara, USA, sayantan@ece.ucsb.edu
Lakis Christodoulou, Florida Atlantic University, USA, lakischrist@hotmail.com
Tat-Seng Chua, National University of Singapore, Singapore, chuats@comp.nus.edu.sg
Jong-Moon Chung, Yonsei University, Korea, jmc@yonsei.ac.kr
Pau-Choo Chung, National Cheng Kung University,Taiwan, Taiwan, pcchung@eembox.ee.ncku.edu.tw
Alexandre Ciancio, University of Southern California, USA, ciancio@lps.ufrj.br
Ioan Cleju, Univ. of Konstanz, Germany, cleju@inf.uni-konstanz.de
Cristian Coarfa, Baylor College of Medicine, USA, cristian.coarfa@gmail.com
Israel Cohen, Technion - Israel Institue of Technology, Israel, icohen@ee.technion.ac.il
Jonathan Connell, IBM Research, USA, jconnell@us.ibm.com
Kai Cordes, Leibniz Universit�t Hannover, Germany, cordes@tnt.uni-hannover.de
Paulo Correia, Instituto Superior T�cnico, Portugal, paulo.correia@lx.it.pt
Jason Corso, University of California, Los Angels, USA, jcorso@acm.org
Luis Corte-Real, F.E. - U. Porto / I.N.E.S.C. Porto, Portugal, lreal@inescporto.pt
Marzia Corvaglia, University of Brescia, Italy, marzia.corvaglia@ing.unibs.it
Baris Coskun, Polytechnic University, USA, baris.coskun@gmail.com
Ingemar Cox, University College London, United Kingdom, ingemar@ee.ucl.ac.uk
Olivier Crave, Ecole Nationale Sup�rieure des T�l�communications, France, crave@enst.fr
Rita Cucchiara, University of Modena and Reggio Emilia, Italy, cucchiara.rita@unimore.it
Jinshi Cui, Peking University, P.R. China, cjs@cis.pku.edu.cn
Yi Cui, Vanderbilt University, USA, yi.cui@vanderbilt.edu
Qionghai Dai, tsinghua university, P.R. China, qhdai@tsinghua.edu.cn
Shengyang Dai, Northwestern University, USA, s-dai@northwestern.edu
Marco Dalai, University of Brescia, Italy, marco.dalai@ing.unibs.it
Gyorgy Dan, KTH,Royal Institute of Technology, Sweden, gyuri@s3.kth.se
Mohamed Daoudi, GET/INT, Telecom Lille1, LIFL (UMR USTL-CNRS 8022), France, daoudi@lifl.fr
Juan Carlos De Martin, Politecnico di Torino, Italy, demartin@polito.it
Ricardo de Queiroz, Univ. of Brasil, Brazil, queiroz@ieee.org
Alberto Del Bimbo, University of Firenze, Italy, delbimbo@dsi.unifi.it
Julie Delon, ENST, France, delon@tsi.enst.fr
David Demirdjian, MIT, USA, demirdji@csail.mit.edu
Xavier Descombes, INRIA, France, xavier.descombes@sophia.inria.fr
Yi Ding, Oklahoma State University, USA, yi.ding@okstate.edu
Zhen Ding, Raytheon Canada Ltd, Canada, zhen_ding@raytheon.com
Sascha Disch, Fraunhofer IIS, Germany, dsh@iis.fraunhofer.de
Ajay Divakaran, MERL, USA, ajayd@merl.com
Chabane Djeraba, University of Sciences and Technologies of Lille, France, chabane.djeraba@lifl.fr
David Doermann, University of Maryland Institute for Advanced Computer Studies, USA, doermann@umiacs.umd.edu
Minghui Dong, Institute for Infocomm Research, Singapore, mhdong@i2r.a-star.edu.sg
Xin Dong, HKUST, Hong Kong, xdong@ust.hk
Chitra Dorai, IBM T.J. Watson Research Center, USA, dorai@us.ibm.com
Ralf Dragon, Leibniz Universit�t Hannover, Germany, dragon@tnt.uni-hannover.de
Ling-Yu Duan, Institute for Infocomm Research, Singapore, lingyu@i2r.a-star.edu.sg
Luis Ducla, I.S.C.T.E. / I.T.Lisbon, Portugal, lds@lx.it.pt
Sorina Dumitrescu, McMaster University, Canada, sorina@mail.ece.mcmaster.ca
Shahram Ebadollahi, IBM, USA, ebad@us.ibm.com
Bernd Edler, Leibniz Universt�t Hannover, Germany, edler@tnt.uni-hannover.de
Ong Ee Ping, Institute for Infocomm Research, Singapore, epong@i2r.a-star.edu.sg
Abdulmotaleb El Saddik, University of Ottawa, Canada, abed@mcrlab.uottawa.ca
Tobias Elbrandt, Leibniz Universit�t Hannover, Germany, elbrandt@tnt.uni-hannover.de
Alex Eleftheriadis, Layered Media, Inc., USA, alex@layeredmedia.com
Sabu Emmanuel, Nanyang Technological University, Singapore, asemmanuel@ntu.edu.sg
How Lung Eng, I2R, Singapore, hleng@i2r.a-star.edu.sg
Ramin Eslami, McMaster University, Canada, reslami@ieee.org
Guoliang Fan, Oklahoma State University, USA, glfan@okstate.edu
Xin Fan, Oklahoma State University, USA, xin.fan@okstate.edu
Tao Fang, University of Wales Swansea, United Kingdom, t.fang@swansea.ac.uk
Farzam Farbiz, A-Star Institute for Infocomm Research, Singapore, farbizf@i2r.a-star.edu.sg
S�rgio Faria, E.S.T.G. - I.P. Leiria / I.T. Lisbon, Portugal, sfaria@estg.ipleiria.pt
Christoph Fehn, Fraunhofer Institute for Telecommunications, Germany, christoph.fehn@hhi.fraunhofer.de
Gerardo Fernandez-Escribano, Instituto de Investigaci�n en Inform�tica de Albacete, Spain, gerardo@dsi.uclm.es
Markus Fidler, TU Darmstadt, Germany, fidler@ieee.org
Norsheila Fisal, Universiti Teknologi Malaysia, Malaysia, sheila@fke.utm.my
Dinei Florencio, Microsoft Research, USA, dinei@microsoft.com
Say Wei Foo, Nanyang Technological University, Singapore, eswFoo@ntu.edu.sg
David Foran, The Cancer Institute of New Jersey, USA, djf@pleiad.umdnj.edu
Soren Forchhammer, Technical University of Denmark, Denmark, sf@com.dtu.dk
James Fowler, Mississippi State University, USA, fowler@ece.msstate.edu
Pasi Franti, Univ. of Joensuu, Finland, franti@cs.joensuu.fi
Jason Fritts, Saint Louis University, USA, jfritts@slu.edu
Pascal Frossard, Swiss Federal Institute of Technology - EPFL, Switzerland, pascal.frossard@epfl.ch
John Galeotti, Carnegie Mellon Univ, USA, jgaleotti@cmu.edu
Eric Galmar, Institut Eurecom, France, eric.galmar@eurecom.fr
Woon Seng Gan, Nanyang Technological University, Singapore, ewsgan@ntu.edu.sg
Sun Gang, ZheJiang University, P.R. China, sigon.hot@gmail.com
Sheng Gao, Institute for Infocomm Research, Singapore, gaosheng@i2r.a-star.edu.sg
Xinbo Gao, Xidian University, P.R. China, xbgao@ieee.org
Rosario Garroppo, University of Pisa, Italy, r.garroppo@iet.unipi.it
Daniel Gatica-Perez, IDIAP Research Institute, Switzerland, gatica@idiap.ch
Ralf Geiger, Fraunhofer Institute for Digital Media Technology, Germany, ggr@idmt.fraunhofer.de
Dimitris Geneiatakis, University of the Aegean,, Greece, dgen@aegean.gr
Shahram Ghandeharizadeh, USC, USA, shahram@pollux.usc.edu
Giorgio Giacinto, University of Cagliari, Italy, giacinto@diee.unica.it
Kwong Huang Goh, Institute for Infocomm Research, Singapore, khgoh@i2r.a-star.edu.sg
Leiguang Gong, Watson Research Center, IBM, USA, leiguang@us.ibm.com
Yihong Gong, NEC Labs American, USA, ygong@sv.nec-labs.com
Adam Goode, Carnegie Mellon Univ, USA, agoode@andrew.cmu.edu
Burak Gorkemli, Koc University, Turkey, bgorkemli@ku.edu.tr
Hongmei Gou, University of Maryland, College Park, USA, hmgou@eng.umd.edu
Yann Gousseau, ENST, France, gousseau@tsi.enst.fr
Scott Grant, University of Missouri-Columbia, USA, ScottGS@umsystem.edu
Sonja Grgic, University of Zagreb, Croatia, sonja.grgic@fer.hr
Ismael Grimeau, ENST, France, grimeau@tsi.enst.fr
William Grosky, U of Michigan, USA, wgrosky@umich.edu
William Gruver, Intelligent Robotics Corporation, Canada, gruver@cs.sfu.ca
Cuntai Guan, Institute for Infocomm Research, Media Div., Singapore, ctguan@i2r.a-star.edu.sg
Ling Guan, Ryerson University, Canada, lguan@ee.ryerson.ca
Lionel Gueguen, Get - Telecom Paris, France, lgueguen@tsi.enst.fr
Christine Guillemot, IRISA-INRIA, France, France, christine.guillemot@irisa.fr
Ashwin Gumaste, Indian Institute of Technology, Bombay/University of Texas at Dallas, India, ashwing@ieee.org
Jing-Ming Guo, National Taiwan University of Science and Technology, Taiwan, jmguo@seed.net.tw
Jinhong Guo, Panasonic Information and Networking Technologies Laboratory, USA, kguo@ieee.org
Yang Guo, Thomson, Inc, USA, yang.guo@thomson.net
Zhen Guo, State University of New York at Binghamton, USA, zguo1@binghamton.edu
Wolfgang H�rst, Albert-Ludwigs-Universit�t Freiburg, Germany, huerst@informatik.uni-freiburg.de
Martin Hagan, Oklahoma State University, USA, martin.t.hagan@okstate.edu
Huang Haibin, Institute for Infocomm Research, Singapore, hhuang@i2r.a-star.edu.sg
Alan Hanjalic, Delft University of Technology, The Netherlands, a.hanjalic@tudelft.nl
Lynda Hardman, CWI, The Netherlands, Lynda.Hardman@cwi.nl
Kalva Hari, Florida Atlantic University, USA, hari@cse.fau.edu
Alexander Haubold, Columbia University, USA, ahaubold@cs.columbia.edu
Alexander Hauptmann, Carnegie Mellon University, USA, alex@cs.cmu.edu
Joseph Havlicek, University of Oklahoma, USA, joebob@ou.edu
Dajun He, Zhangjiang Industry Park, P.R. China, dajunhe@gmail.com
Shan He, University of Maryland, College Park, USA, shanhe@eng.umd.edu
Yifeng He, Ryerson University, Canada, yhe@ee.ryerson.ca
Zhihai He, University of Missouri-Columbia, USA, hezhi@missouri.edu
Patrick Heas, IRISA, France, Patrick.Heas@irisa.fr
Douglas Heisterkamp, Oklahoma State University, USA, doug@cs.okstate.edu
King Man Ho, The Hong Kong Polytechnic University, Hong Kong, 04900865r@polyu.edu.hk
Jason Hong, Carnegie Mellon University, USA, jasonh@cs.cmu.edu
Jun-Wei Hsieh, Yuan Ze University, Taiwan, shieh@saturn.yzu.edu.tw
Chiou-Ting Hsu, National Tsing Hua University, Taiwan, cthsu@cs.nthu.edu.tw
Winston Hsu, National Taiwan University, Taiwan, winston@csie.ntu.edu.tw
Wu Hsu, University of Ming Chuan, Taiwan, wuhsiao@gmail.com
Jing Hu, University of California, Santa Barbara, USA, jinghu@umail.ucsb.edu
Ningning Hu, Carnegie Mellon University, USA, hnn@cs.cmu.edu
Yongjian Hu, South China University of Technology, P.R. China, yongjianhu@mmc.kaist.ac.kr
Yuhen Hu, Univ. of Wisconsin at Madison, USA, hu@engr.wisc.edu
Kien Hua, University of Central Florida, USA, kienhua@cs.ucf.edu
Xian-Sheng Hua, Microsoft Research Asia, P.R. China, xshua@microsoft.com
Cheng Huang, Microsoft Research, USA, chengh@microsoft.com
Chung-Lin Huang, Department of Electrical Engineering, National Tsing Hua University, Taiwan, Taiwan, clhuang@ee.nthu.edu.tw
Chung-Ming Huang, National Cheng Kung University, Taiwan, huangcm@locust.csie.ncku.edu.tw
Dong-Yan Huang, Institute for Infocomm Research, Singapore, huang@i2r.a-star.edu.sg
Jianwei Huang, Princeton University, USA, jianweih@princeton.edu
Qingming Huang, Graduate School of Chinese Academy of Sciences, P.R. China, qmhuang@jdl.ac.cn
Rui Huang, Rutgers University, USA, ruihuang@cs.rutgers.edu
Weimin Huang, Institute for Infocomm Research, Singapore, wmhuang@i2r.a-star.edu.sg
Xiang Huang, Northwestern Univ., USA, x-huang@northwestern.edu
Xu Huang, University of Canberra, Australia, Xu.Huang@canberra.edu.au
Yu Huang, Thomson Corporate Research, Princeton, USA, yu.huang2@thomson.net
Benoit Huet, Institut Eurecom, France, benoit.huet@eurecom.fr
Wenjun Huo, Information Engineering University, P.R. China, huowj2008@gmail.com
Bor Jiunn Hwang, University of Ming-Chuan, Taiwan, bjhwang@mcu.edu.tw
Wen-Liang Hwang, Institute of Information Science, Academia Sinica, Taiwan, whwang@iis.sinica.edu.tw
Yuri Ivanov, Mistubishi Electric Research Laboratories, USA, ivanov@merl.com
Giridharan Iyengar, IBM TJ Watson Research Center, USA, giyengar@us.ibm.com
Alejandro Jaimes, Fuji Xerox, Japan, ajaimes@ee.columbia.edu
Anil Jain, Michigan State University, USA, jain@cse.msu.edu
Vivek Jain, Robert Bosch LLC, USA, vivekjain@hotmail.com
Jyh-Horng Jeng, I-Shou University, Taiwan, jjeng@isu.edu.tw
Byeungwoo Jeon, Sung Kyun Kwan University, Korea, bjeon@skku.edu
Wen Ji, Institute of Computing Technology, Chinese Academy of Sciences, P.R. China, jiwen@ict.ac.cn
Jintao Jiang, House Ear Institute, USA, jjt@icsl.ucla.edu
Shuqiang Jiang, Institute of Computing Technology, Chinese Academy of Sciences, Beijing 100080, P.R. China, sqjiang@jdl.ac.cn
Xiaoyi Jiang, University of Muenster, Germany, xjiang@math.uni-muenster.de
Chun Jin, Carnegie Mellon University, USA, cjin@cs.cmu.edu
Hongxia Jin, IBM Almaden Research Center, USA, jin@us.ibm.com
Jesse Jin, University of Newcastle, Australia, jesse.jin@newcastle.edu.au
Qin Jin, Carnegie Mellon University, USA, qjin@cs.cmu.edu
feng jing, microsoft research asia, P.R. China, fengjing@microsoft.com
Stian Johansen, Norwegian University of Science and Technology, Norway, stianjo@q2s.ntnu.no
Louis Johnson, Oklahoma State University, USA, lgjohn4434@sbcglobal.net
Inbong Joo, University of Science and Technology, Korea, inbong.joo@gmail.com
Szu-Chen Jou, Carnegie Mellon University, USA, scjou@cs.cmu.edu
Jo�l Jung, France Telecom R&D, France, joelb.jung@francetelecom.com
Dan Jurca, EPFL, Switzerland, dan.jurca@epfl.ch
Yasemin Kahya, Bogazici University, Turkey, kahya@boun.edu.tr
Susanna Kaiser, DLR, Germany, susanna.kaiser@dlr.de
Antonius Kalker, Hewlett-Packard, USA, ton.kalker@hp.com
Li-Wei Kang, Academia Sinica, Taiwan, lwkang@iis.sinica.edu.tw
Mohan Kankanhalli, National University of Singapore, Singapore, mohan@comp.nus.edu.sg
John Kender, Columbia U, USA, jrk@cs.columbia.edu
Chris Kerr, University of Alberta, Canada, kerr@cs.ualberta.ca
Anna Kim, NTNU, Norway, annak@iet.ntnu.no
Jinwoong Kim, ETRI, Korea, jwkim@etri.re.kr
Jong-Seong Kim, Andong National University, Korea, rhody@hanmail.net
JongWon Kim, GIST (Gwangju Institute of Science & Technology), Korea, jongwon@gist.ac.kr
Pankoo Kim, chosun univ., Korea, pkkim@chosun.ac.kr
Sang-Wook KIM, Samsung AIT, Korea, sangwookkim@samsung.com
Irwin King, The Chinese University of Hong Kong, Hong Kong, king@cse.cuhk.edu.hk
Josef Kittler, University of Surrey, United Kingdom, j.kittler@surrey.ac.uk
Patrick Klie, Leibniz Universit�t Hannover, Germany, klie@tnt.uni-hannover.de
Sven Klomp, Leibniz Universit�t Hannover, Germany, klomp@tnt.uni-hannover.de
Hanseok KO, Korea University, Korea, hsko@korea.ac.kr
Soo Ngee Koh, Nanyang Technological University, Singapore, esnkoh@ntu.edu.sg
Effrosyni Kokiopoulou, EPFL, Switzerland, effrosyni.kokiopoulou@epfl.ch
John Kominek, Carnegie Mellon University, USA, jkominek@cs.cmu.edu
Gerd Kortuem, Lancaster University, United Kingdom, kortuem@comp.lancs.ac.uk
Alex Kot, Nanyang Technological University, Singapore, eackot@ntu.edu.sg
Evangelos Kotsovinos, Deutsche Telekom Laboratories, Germany, evangelos.kotsovinos@telekom.de
Deepa Kundur, Texas A&M University, USA, deepa@ece.tamu.edu
Gerald Kunzmann, Munich University of Technology, Germany, gerald.kunzmann@tum.de
Tien-Ying Kuo, National Taipei University of Technology, Taiwan, tykuo@ee.ntut.edu.tw
Engin Kurutepe, TU Berlin, Germany, kurutepe@nue.tu-berlin.de
David L�pez Berzosa, Universidad de Leon, Spain, david.lopez@unileon.es
Sa�d Ladjal, ENST, France, ladjal@tsi.enst.fr
Shang-Hong Lai, National Tsing Hua University, Taiwan, lai@cs.nthu.edu.tw
Ari Lakaniemi, Nokia Corporation, Finland, ari.lakaniemi@nokia.com
Li Lao, Google, USA, llao@cs.ucla.edu
Mihai Lazarescu, Curtin University, Australia, m.lazarescu@curtin.edu.au
Chung-Nan Lee, University of Yat-sen, Taiwan, cnlee@cse.nsysu.edu.tw
Dai-boong Lee, Pohang University of Science and Technology (POSTECH), Korea, boong@postech.ac.kr
Dong-U Lee, UCLA, USA, dongu@icsl.ucla.edu
Il-Gu Lee, Next Generation Wireless LAN Research Team, ETRI, Korea, iglee@etri.re.kr
Ivan Lee, Ryerson, Canada, ilee@ee.ryerson.ca
JengFarn Lee, Academia Sinica, Taiwan, Taiwan, kunimi@iis.sinica.edu.tw
Michael Lee, CSIRO ICT Centre, Australia, michael.lee@csiro.au
Suh-Yin Lee, National Chiao Tung University, Taiwan, R. O. C., Taiwan, sylee@csie.nctu.edu.tw
Wan-Chi Lee, University of Southern California, USA, wanchile@usc.edu
Riccardo Leonardi, University of Brescia, Italy, riccardo.leonardi@ing.unibs.it
Athanasios Leontaris, Dolby Laboratories, USA, thanos.leontaris@gmail.com
Jin-Jang Leou, National Chung Cheng University, Taiwan, jjleou@cs.ccu.edu.tw
Monchai Lertsutthiwong, Oregon State University, USA, lertsumo@eecs.oregonstate.edu
Cheng-Chi Leung, Vice Chair, Hong Kong, cclc@lwfss.edu.hk
Howard Wing Ho Leung, City University of Hong Kong, Hong Kong, howard@cityu.edu.hk
Michael Lew, Leiden University, The Netherlands, mlew@liacs.nl
Baoxin Li, Arizona State University, USA, baoxin.li@asu.edu
Bing Li, Tianjin University, P.R. China, libingice19@yahoo.com.cn
Bo Li, Hong Kong University of Science and Technology, P.R. China, bli@cs.ust.hk
Dongge Li, Motorola Labs, USA, dongge.li@motorola.com
Eric Li, Intel China Research Centre, Intel Corp., P.R. China, eric.q.li@intel.com
Fan Li, Xi'an Jiaotong University, P.R. China, lifan@mail.xjtu.edu.cn
Haizhou Li, Institute for Infocomm Research, Singapore, hli@i2r.a-star.edu.sg
Hillman Li, HKUST, Hong Kong, hillmanl@cse.ust.hk
Houqiang Li, University of Science and Technology of China, P.R. China, lihq@ustc.edu.cn
Jiang Li, Microsoft Research Asia, P.R. China, jiangli@microsoft.com
Jin Li, Microsoft Research, USA, jinl@microsoft.com
Kang Li, Carnegie Mellon Univ, USA, kangl@andrew.cmu.edu
Linhai Li, Zhengzhou Information Science and Technology Institute, P.R. China, cj_llh@163.com
Liyuan Li, Institute for Infocomm Research, Singapore, lyli@i2r.a-star.edu.sg
Mingjing Li, Microsoft Research Asia, P.R. China, mjli@microsoft.com
Shenjie Li, The Hong Kong University of Science and Technology, Hong Kong, lisj@cse.ust.hk
Shipeng Li, Microsoft Research Asia, P.R. China, spli@microsoft.com
Wenlong Li, Intel China Research Center, P.R. China, wenlong.li@intel.com
Xiaokun Li, Intelligent automation inc., USA, xiaokun_li@yahoo.com
Xiaolin Li, Oklahoma State University, USA, xiaolin@cs.okstate.edu
Xin Li, Lane Department of CSEE, West Virginia University, USA, xinl@csee.wvu.edu
Xin Li, West Virginia University, USA, xin.li@mail.wvu.edu
Xuelong Li, University of London, United Kingdom, xuelong_li@ieee.org
Ying Li, IBM T. J. Watson Research Center, USA, yingli@us.ibm.com
Zhengguo Li, Institute for Inforcomm Research, Singapore, ezgli@i2r.a-star.edu.sg
Zhi Li, National University of Singapore, Singapore, lizhi@nus.edu.sg
Zhifeng LI, The Chinese University of Hong Kong, Hong Kong, zfli@se.cuhk.edu.hk
Zhu Li, Motorola Labs, USA, zhu.li@motorola.com
Jie Liang, Simon Fraser University, Canada, jiel@sfu.ca
Jin Liang, University of Illinois at Urbana-Champaign, USA, jinliang@cs.uiuc.edu
Yi Liang, Qualcomm, USA, yiliang@stanfordalumni.org
Mark Liao, Academia Sinica, Taiwan, liao@iis.sinica.edu.tw
Wanjiun Liao, National Taiwan University, Taiwan, wjliao@cc.ee.ntu.edu.tw
Bj�rnar Lib�k, Norwegian University of Science and Technology, Norway, blibak@gmail.com
Wen-Nen Lie, National Chong cheng university, Taiwan, ieewnl@ccunix.ccu.edu.tw
Wen-Nung Lie, National Chung-Cheng University, Taiwan, ieewnl@ccu.edu.tw
Rainer Lienhart, Univ of Augsberg, Germany, Rainer.Lienhart@informatik.uni-augsburg.de
Joo-Hwee Lim, Institute for Infocomm Research, Singapore, joohwee@i2r.a-star.edu.sg
Kyung Mook Lim, University of Science and Technology, Korea, kmlim@etri.re.kr
Livio Lima, University of Brescia, Italy, livio.lima@ing.unibs.it
Chia-Wen Lin, Natl. Chung-Cheng Univ., Taiwan, cwlin@cs.ccu.edu.tw
Chih-Jen Lin, National Taiwan University, Taiwan, cjlin@csie.ntu.edu.tw
Ruei-Sung Lin, Motorola Lab in Chicago, USA, rueisung@gmail.com
Wei-Hao Lin, Carnegie Mellon University, USA, whlin@cs.cmu.edu
Weisi Lin, Nanyang Technological University, Singapore, wslin@ntu.edu.sg
Yuan Lin, Norwegian University of Science and Technology, Norway, yuan.lin@q2s.ntnu.no
Ivan Linscott, Stanford University, USA, linscott@stanford.edu
Dong Liu, University of Science and Technology of China, P.R. China, discoverer.liu@gmail.com
Guizhong Liu, Xi'an Jiaotong University, P.R. China, liugz@xjtu.edu.cn
Huaping Liu, Oregon State University, USA, hliu@eecs.oregonstate.edu
Jianzhuang Liu, The Chinese University of Hong Kong, Hong Kong, jzliu@ie.cuhk.edu.hk
Jonathan Liu, University of Florida, USA, jcliu@cise.ufl.edu
Kang Liu, Leibniz Universit�t Hannover, Germany, kang@tnt.uni-hannover.de
Lijie Liu, Johns Hopkins University, USA, ljliu@jhu.edu
Lurng-Kuo Liu, IBM T.J. Watson Research Center, USA, lkliu@us.ibm.com
Qingshan Liu, Rutgers University, USA, qsliu@dragon.rutgers.edu
Qiong Liu, Fuji-Xerox Palo Alto Laboratory, USA, liu@fxpal.com
Shan Liu, MERL, USA, liu@merl.com
Tyng-Luh Liu, Institute of Information Science, Academia Sinica, Taiwan, Taiwan, liutyng@iis.sinica.edu.tw
Xiaoming Liu, GE Global Research, USA, liux@research.ge.com
Yazhou Liu, Harbin Institute of Technology, P.R. China, yzliu@jdl.ac.cn
Yi Liu, Zhejiang University, P.R. China, yiliu@zju.edu.cn
Zhu Liu, AT & T Laboratories, USA, zliu@research.att.com
Chun-Shien Lu, Institute of Information Science, Academia Sinica, Taiwan, lcs@iis.sinica.edu.tw
Haibin Lu, University of Missouri - Columbia, USA, luhaibin@missouri.edu
Lie Lu, Microsoft Research Asia, P.R. China, llu@microsoft.com
Mei-Hsuan Lu, Carnegie Mellon University, USA, meihsual@andrew.cmu.edu
Yan Lu, Internet Media Group, Microsoft Research Asia, P.R. China, yanlu@microsoft.com
Yijuan Lu, University of Texas at San Antonio, USA, lyijuan@cs.utsa.edu
Rastislav Lukac, Epson Canada Ltd., Canada, lukacr@ieee.org
Jiebo Luo, Eastman Kodak Company, USA, jiebo.luo@kodak.com
Jochen Lux, University of Augsburg, Germany, jochen.lux@informatik.uni-augsburg.de
Kai-Kuang Ma, Nanyang Technological University, Singapore, ekkma@ntu.edu.sg
Matthew Ma, IPV Inc, USA, mattma@ieee.org
Wei-Ying Ma, Microsoft Research, China, P.R. China, wyma@microsoft.com
Yanzhuo Ma, Xidian University, P.R. China, yzma@mail.xidian.edu.cn
Yi Ma, University of Illinois at Urbana-Champaign, USA, yima@uiuc.edu
Max M�hlh�user, Technical University Darmstadt, Germany, max@informatik.tu-darmstadt.de
Namunu Maddage, Institute for Infocomm Research, Singapore, maddage@i2r.a-star.edu.sg
Enrico Magli, Politecnico di Torino, Italy, enrico.magli@polito.it
Marcus Magnor, MPG, Germany, magnor@mpi-sb.mpg.de
Hafiz Malik, Stevens Institute of Technology, USA, hafiz.malik@stevens.edu
Robert Malkin, Google, Inc., USA, robert.malkin@gmail.com
Hong Man, Stevens Institute of Technology, USA, hman@stevens.edu
Francesca Manerba, University of Brescia, Italy, francesca.manerba@ing.unibs.it
Bangalore Manjunath, UCSB, USA, manj@ece.ucsb.edu
Yinian Mao, University of Maryland, College Park, USA, ymao@eng.umd.edu
Jeich Mar, Department of Communication Engineering, Yuan-Ze University, Taiwan, eejmar@saturn.yzu.edu.tw
Michael W. Marcellin, ECE Dept, The University of Arizona, USA, marcellin@ece.arizona.edu
Javier Marcello, Universidad de Las Palmas de Gran Canaria (ULPGC), Spain, fmarcello@dsc.ulpgc.es
Yelizaveta Marchenko, National University of Singapore, Singapore, yelizaveta.marchenko@gmail.com
David Marimon, EPFL, Switzerland, david.marimon@epfl.ch
Athina Markopoulou, University of California, Irvine, USA, amarko@stanfordalumni.org
Detlev Marpe, Fraunhofer HHI, Germany, marpe@hhi.de
Aleix Martinez, The Ohio State University, USA, aleix@ece.osu.edu
Enrico Masala, Politecnico di Torino, Italy, masala@polito.it
Simon Masnou, Universite Paris 6, France, masnou@ann.jussieu.fr
Marco Matassoni, ITC-irst, Italy, matasso@itc.it
John Mateer, York University, United Kingdom, jwm10@ohm.york.ac.uk
Xue Mei, University of Maryland, College Park, USA, xuemei@umiacs.umd.edu
Bernard Merialdo, Institut EURECOM, France, merialdo@eurecom.fr
Pierangelo Migliorati, University of Brescia, Italy, Italy, pierangelo.migliorati@ing.unibs.it
Patrick Mikulastik, Leibniz Universit�t Hannover, Germany, mikulast@tnt.uni-hannover.de
Yasuyuki Miura, Shonan Institute of Technology, Japan, miu@info.shonan-it.ac.jp
Tony Mo, HKUST, Hong Kong, tonymo@cse.ust.hk
Simon Moncrieff, Curtin University, Australia, simonm@cs.curtin.edu.au
Ken'ichi Morooka, Kyushu University, Japan, morooka@digital.med.kyushu-u.ac.jp
Ramon Morros, Technical University of Catalonia (UPC), Spain, morros@gps.tsc.upc.edu
Scott Moskowitz, Blue Spike, Inc., USA, scott@bluespike.com
Philippe Mulhem, Joseph Fourier University, France, mulhem@imag.fr
Lily Mummert, Intel Research, USA, lily.b.mummert@intel.com
Padma Mundur, University of Maryland, USA, pmundur@umiacs.umd.edu
Masayuki Murata, Osaka University, Japan, murata@cmc.osaka-u.ac.jp
Frank Nack, Universit� Claude Bernard Lyon 1, France, frank.nack@liris.cnrs.fr
Milind Naphade, IBM T J Watson Research Center, USA, naphade@us.ibm.com
Matthias Narroschke, Leibniz Universit�t Hannover, Germany, narrosch@tnt.uni-hannover.de
Apostol Natsev, IBM T. J. Watson Research Center, USA, natsev@us.ibm.com
Antonio Navarro, University of Aveiro, Portugal, navarro@av.it.pt
Shi-Yong Neo, National University of Singapore, Singapore, neoshiyo@comp.nus.edu.sg
Chong-Wah Ngo, City University of Hong Kong, Hong Kong, cwngo@cs.cityu.edu.hk
Dieu Thanh Nguyen, Leibniz Universitaet Hannover, Germany, nguyen@tnt.uni-hannover.de
Huu Thanh Nguyen, TU Hanoi, Vietnam, thanhnh@mail.hut.edu.vn
Thinh Nguyen, Oregon State, USA, thinhq@eecs.oregonstate.edu
Zhicheng Ni, NJIT, USA, zhicheng_ni@hotmail.com
Nicola Nicolici, McMaster University, Canada, nicola@ece.mcmaster.ca
Waldo Nogueira, Leibniz Universit�t Hannover, Germany, nogueira@tnt.uni-hannover.de
Paulo Nunes, I.S.C.T.E. / I.T.Lisbon, Portugal, paulo.nunes@lx.it.pt
Tin Lay Nwe, National University of Singapore, Singapore, tlnma@i2r.a-star.edu.sg
Jun Ohya, Waseda University, Japan, ohya@waseda.jp
Wei Tsang Ooi, National University of Singapore, Singapore, ooiwt@comp.nus.edu.sg
Vincent Oria, NJIT, USA, oria@cis.njit.edu
Antonio Ortega, USC, USA, ortega@sipi.usc.edu
Joern Ostermann, Leibniz Universitaet Hannover, Germany, ostermann@tnt.uni-hannover.de
Juntao Ouyang, Tsinghua University, P.R. China, oyjt1982@gmail.com
Patrick P�rez, INRIA, France, patrick.perez@irisa.fr
Pietro Pala, University of Firenze, Italy, pala@dsi.unifi.it
Jeng-Shyang Pan, National Kaohsiung University of Applied Sciences, Taiwan, jspan@cc.kuas.edu.tw
Jianping Pan, University of Victoria, Canada, pan@uvic.ca
Sethuraman Panchanathan, ASU, USA, panch@asu.edu
Purvin Pandit, Thomson Inc., USA, purvin.pandit@thomson.net
Jeffrey Pang, Carnegie Mellon University, USA, jeffpang@cs.cmu.edu
Krit Panusopone, Motorola, USA, krit@motorola.com
Panagiotis Papadimitriou, Democritus University, Greece, Greece, ppapadim@ee.duth.gr
Nikolaos Papanikolopoulos, University of Minnesota, USA, npapas@cs.umn.edu
Toufiq Parag, Rutgers University, USA, toufiq.parag@gmail.com
Jehan-Francois Paris, University of Houston, USA, paris@cs.uh.edu
In-Cheol Park, KAIST, Korea, icpark@ee.kaist.ac.kr
Namje Park, ETRI, Korea, namjepark@etri.re.kr
Nohpill Park, Oklahoma State University, USA, npark@cs.okstate.edu
Youngchoon Park, Johnson controls, Inc, USA, Youngchoon.Park@jci.com
Jussi Parkkinen, Univ. of Joensuu, Finland, parkkinen@cs.joensuu.fi
Siegmund Pastoor, HHI, Germany, pastoor@hhi.fraunhofer.de
Kedar Patwardhan, University of Minnesota, USA, kedar@umn.edu
William Pearlman, Rensselaer Polytchnic Institute, USA, pearlw@rpi.edu
Kadir Peker, Bilkent University, Turkey, kpeker@bilkent.edu.tr
Dongming Peng, Univ. Nebraska - Lincoln, USA, dpeng@unl.edu
Jingliang Peng, University of Southern California, USA, jingliap@gmail.com
Aleksi Penttinen, Helsinki University of Technology, Finland, aleksi.penttinen@tkk.fi
Fernando Pereira, IST-TUL, Portugal, fp@lx.it.pt
Manuela Pereira, University of Beira Interior, Portugal, mpereira@di.ubi.pt
B�atrice Pesquet, Ecole Nationale Sup�rieure des T�l�communications, France, pesquet@tsi.enst.fr
Jean-Christophe Pesquet, Univ. Marne la Vallee, France, pesquet@univ-mlv.fr
Teodora Petrisor, ENST, France, petrisor@tsi.enst.fr
Dinh Phung, Curtin University of Technology, Australia, phung@cs.curtin.edu.au
Sergej Piekh, Leibniz Universit�t Hannover, Germany, piekh@tnt.uni-hannover.de
Gemma Piella, Universitat Pompeu Fabra, Spain, piella@ieee.org
Xue Ping, Nanyang Technological University, Singapore, epxue@ntu.edu.sg
Gopal Pingali, IBM TJ Watson Research Center, USA, gpingali@us.ibm.com
Gwenaelle Piriou, IRISA, France, gpiriou@irisa.fr
Aleksandra Pizurica, Ghent University, Belgium, Aleksandra.Pizurica@telin.UGent.be
Konstantinos Plataniotis, University of Toronto, Canada, kostas@comm.utoronto.ca
Jan Plogsties, Fraunhofer IIS, Germany, Jan.Plogsties@iis.fraunhofer.de
Richard Pollock, PCI Geomatics, Canada, pollock@pcigeomatics.com
Fatih Porikli, Mitsubishi Electric Research Laboratories, USA, fatih@merl.com
Gaurav Pradhan, University of Texas at Dallas, USA, gaurav@utdallas.edu
Guo-Jun Qi, University of Science and Technology of China, P.R. China, qgj@mail.ustc.edu.cn
Xueming Qian, Xi'an Jiaotong University, P.R. China, qxm@mailst.xjtu.edu.cn
Roy Qiao, CSIRO ICT Centre, Australia, rong-yu.qiao@csiro.au
Maria Paula Queluz, Instituto Superior T�cnico, Portugal, paula.queluz@lx.it.pt
Faisal Qureshi, University of Toronto, Canada, faisal@cs.toronto.edu
Martin R�der, University of Constanz, Germany, martin.roeder@uni-konstanz.de
Hayder Radha, Michigan State University, USA, radha@egr.msu.edu
Regunathan Radhakrishnan, Dolby Laboratories Inc, USA, regu.r@dolby.com
Susanto Rahardja, Institute for Infocomm Research, Singapore, rsusanto@i2r.a-star.edu.sg
Syed M. Rahman, Minnesota State University, Mankato, USA, mahbubur.syed@mnsu.edu
Deepu Rajan, Nanyang Technological University, Singapore, asdrajan@ntu.edu.sg
Sean Ramprashad, DoCoMo Communications Labs, USA, USA, ramprashad@docomolabs-usa.com
Zorana Randjelovic, EPFL, Switzerland, zorana.randjelovic@epfl.ch
Adnan Rashdi, UET, Pakistan, adnanrashdi@gmail.com
Carlo Regazzoni, University Of Genova, Italy, carlo@dibe.unige.it
Song Ri, Leibniz Universit�t Hannover, Germany, ri@tnt.uni-hannover.de
Justin Ridge, Nokia, USA, justin.ridge@videocoding.org
Saul Rodriguez, University of Alberta, Canada, srodrigu@cs.ualberta.ca
Martin Roeder, Univ. of Konstanz, Germany, roeder@inf.uni-konstanz.de
Byeong-hee Roh, Ajou University, Korea, bhroh@ajou.ac.kr
Nuno Roma, IST-IT, Portugal, Nuno.Roma@inesc-id.pt
Kenneth Rose, University of California, Santa Barbara, USA, rose@ece.ucsb.edu
Massimo Rovini, University of Pisa, Italy, massimo.rovini@iet.unipi.it
Sujoy Roy, Institute for Infocomm Research, Singapore, sujoy@i2r.a-star.edu.sg
Ting Rui, PLA University of Science and Technology, P.R. China, rting@public1.ptt.js.cn
Javier Ruiz, Technical University of Catalonia (UPC), Spain, jrh@gps.tsc.upc.edu
Amir Said, HP Labs, USA, amir.said@hp.com
Philippe Salembier, Universitat Polit�cnica de Catalunya, Spain, philippe@gps.tsc.upc.es
Aswin Sankaranarayanan, University of Maryland, College Park, USA, aswch@umd.edu
Venkatesh Sarangan, Oklahoma State University, USA, saranga@cs.okstate.edu
Shin'ichi Satoh, National Institute of Informatics, Japan, satoh@nii.ac.jp
George Scheets, Oklahoma State University, USA, george.scheets@okstate.edu
Thomas Schierl, Fraunhofer Institute for Telecommunications - Heinrich-Hertz-Institute, Germany, schierl@hhi.fhg.de
Heiko Schwarz, HHI, Germany, heiko.schwarz@hhi.fhg.de
Nicu Sebe, University of Amsterdam, The Netherlands, nicu@science.uva.nl
Andrew Segall, Sharp Labs, USA, asegall@sharplabs.com
Ivan Selesnick, Polytechnic University, USA, selesi@poly.edu
Husrev Sencar, Polytechnic University, USA, taha@isis.poly.edu
Sudipta Sengupta, Bell Laboratories, Lucent Technologies, USA, sudipta@lcs.mit.edu
Afshin Sepehri , University of Maryland, College Park, USA, afshin@umiacs.umd.edu
Wee Ser, Nanyang Technological University, Singapore, ewser@ntu.edu.sg
Antonio Servetti, Politecnico di Torino, Italy, servetti@polito.it
Metin Sezgin, MIT, USA, mtsezgin@csail.mit.edu
Shiguang Shan, ICT-ISVISION Joint R&D Laboratory for Face Recognition,CAS, P.R. China, sgshan@jdl.ac.cn
Ying Shan, Microsoft AdLab, USA, Ying.Shan@microsoft.com
Yi Shang, University of Missouri, USA, shangy@missouri.edu
Jie Shao, GOOGLE, USA, jieshao@google.com
Gaurav Sharma, University of Rochester, USA, gsharma@ece.rochester.edu
Madhusudana Shashanka, Boston University, USA, shashanka@cns.bu.edu
Bo Shen, Hewlett Packard Laboratories, USA, boshen@hpl.hp.com
Dinggang Shen, University of Pennsylvania School of Medicine, USA, Dinggang.Shen@uphs.upenn.edu
Yuzhong Shen, Old Dominion University, USA, yshen@odu.edu
Shih Sheng-Wen, National Chi Nan University, Taiwan, stone@csie.ncnu.edu.tw
Rui Shi, National University of Singapore, Singapore, shirui@comp.nus.edu.sg
Timothy Shih, Tamkang University, Taiwan, tshih@cs.tku.edu.tw
Hsia Shih-Chang, National Kaohsiung First University of Science and Technology, Taiwan, hsia@ccms.nkfust.edu.tw
Shahram Shirani, McMaster University, Canada, shirani@mcmaster.ca
Yu Shiu, University of Southern California, USA, yshiu@usc.edu
Haiyan Shu, The Chinese University of Hong Kong, Hong Kong, hyshu@ee.cuhk.edu.hk
Louis Shue, Institute for Infocomm Research, Singapore, lshue@i2r.a-star.edu.sg
Alberto Signoroni, University of Brescia, Italy, alberto.signoroni@ing.unibs.it
Eduardo Silva, UFRJ, Brazil, eduardo@lps.ufrj.br
Abhijit Sinha, McMaster University, Canada, abhijit@mail.ece.mcmaster.ca
Klangjai Sithitavorn, Monash University, Australia, klangjai@csse.monash.edu.au
Malcolm Slaney, Yahoo! Research, USA, malcolm@ieee.org
Alan Smeaton, Dublin City University, Ireland, alan.smeaton@dcu.ie
Mikhail Smelyanskiy, Intel, USA, mikhail.smelyanskiy@intel.com
John Smith, IBM T.J.Watson Research Center, USA, jrsmith@watson.ibm.com
Aljoscha Smolic, Fraunhofer HHI, Germany, aljoscha.smolic@hhi.fraunhofer.de
Jack Snoeyink, University of North Carolina - Chapel Hill, USA, snoeyink@cs.unc.edu
Kwang Hoon Sohn, Yonsei Univ., Korea, khsohn@yonsei.ac.kr
Sohum Sohoni, Oklahoma State University, USA, sohum.sohoni@okstate.edu
Joel Sole, Technical University of Catalonia (UPC), Spain, joel@gps.tsc.upc.edu
Hwangjun Song, Pohang University of Science and Technology, Korea, hwangjun@postech.ac.kr
Ronggong Song, National Research Council Canada, Canada, ronggong.song@nrc-cnrc.gc.ca
Xiaomu Song, Northwestern University, USA, xiaomu-song@northwestern.edu
Yan Song, University of Science and Technology of China,, P.R. China, songy@ustc.edu.cn
Ing Yann Soon, Nanyang Technological University, Singapore, eiysoon@ntu.edu.sg
Leonel Sousa, I.S.T. - Technical U. Lisbon / I.N.E.S.C. - I.D., Portugal, las@inesc-id.pt
Giorgos Stamou, National Technical University of Athens, Greece, gstam@softlab.ntua.gr
Nikolce Stefanoski, Universitaet Hannover, Germany, stefanos@tnt.uni-hannover.de
Rainer Stiefelhagen, Universit�t Karlsruhe (TH), Germany, stiefel@ira.uka.de
James Stine, Oklahoma State University, USA, james.stine@okstate.edu
Jacob Strauss, MIT, USA, jastr@mit.edu
Xiao Su, San Jose State University, USA, xsu@email.sjsu.edu
Koduvayur Subbalakshmi, Stevens Institute of Technology, USA, ksubbala@stevens.edu
Karsten Suehring, HHI, Germany, Karsten.Suehring@hhi.fraunhofer.de
Rahul Sukthankar, Intel Research Pittsburgh, USA, rahuls@cs.cmu.edu
Sanghoon Sull, Korea University, Korea, sull@mpeg.korea.ac.kr
Hanwu Sun, Institute for Infocomm Research, Singapore, hwsun@i2r.a-star.edu.sg
Huifang Sun, Mitsubishi Electric Research Laboratories, USA, hsun@merl.com
Ming-Ting Sun, University of Washington, USA, sun@ee.washington.edu
Qibin Sun, I2R, Singapore, qibin@i2r.a-star.edu.sg
Xiaoyan Sun, Microsoft Research Asia, P.R. China, xysun@microsoft.com
Zhaohui Sun, GE Research, USA, sunzh@research.ge.com
Hari Sundaram, Arizona State Univeristy, USA, hari.sundaram@asu.edu
Ashwin Swaminathan, University of Maryland, College Park, USA, ashwins@umd.edu
Heng-Ming Tai, University of Tulsa, USA, tai@utulsa.edu
Wilson Tam, Carnegie Mellon University, USA, yct+@cs.cmu.edu
Tele Tan, Curtin University, Australia, teletan@cs.curtin.edu.au
Yap-Peng TAN, Nanyang Technological University, Singapore, eyptan@ntu.edu.sg
Choon Yik Tang, University of Oklahoma, USA, cytang@ou.edu
Lijun Tang, Columbia University, USA, ljtang@ieee.org
Ming Tang, Chinese Academy of Sciences, P.R. China, tangm@nlpr.ia.ac.cn
Tian TANG, Shanghai Jiaotong University, P.R. China, talentie@hotmail.com
Wilson Tang, HKUST, Hong Kong, wilsont@cse.ust.hk
Yun Tang, Tsinghua University, P.R. China, tangyun98@mails.tsinghua.edu.cn
Dacheng Tao, The Hong Kong Polytechnic University, Hong Kong, dacheng.tao@gmail.com
Dayong Tao, Nanyang Technological University, Singapore, taod0001@ntu.edu.sg
Keith Tegaue, Oklahoma State University, USA, keith.teague@okstate.edu
Luis Teixeira, INESC Porto, Portugal, lmt@inescporto.pt
Jelena Tesic, IBM Watson Research Center, USA, jtesic@us.ibm.com
Jo-Yew Tham, Institute for Infocomm Research, Singapore, thamjy@ieee.org
Johnson Thomas, Oklahoma State University, USA, jpt@cs.okstate.edu
Nikoloas Thomos, EPFL, Switzerland, nikolaos.thomos@epfl.ch
Chunna Tian, Oklahoma State University, USA, chna.tian@okstate.edu
Jun Tian, Thomson Corporate Research, USA, jun.tian@thomson.net
Qi Tian, Institute for Infocomm Research, Singapore, tian@i2r.a-star.edu.sg
Qi Tian, Univresity of Texas at San Antonio, USA, qitian@cs.utsa.edu
Christophe Tillier, ENST Paris, France, tillier@tsi.enst.fr
Christian Timmerer, Klagenfurt University, Austria, christian.timmerer@itec.uni-klu.ac.at
Nicolas Tizon, GET-ENST / Paris, France, tizon@tsi.enst.fr
Claudia Tonoli, University of Brescia, Italy, Claudia.Tonoli@ing.unibs.it
Mercan Topkara, Purdue University, USA, mkarahan@cs.purdue.edu
Umut Topkara, Purdue University, USA, utopkara@cs.purdue.edu
Ivana Tosic, EPFL, Switzerland, ivana.tosic@epfl.ch
Alexis Tourapis, Dolby Laboratories, USA, alexismt@ieee.org
Caetano Traina-Jr, University of Sao Paulo, Brazil, caetano@icmc.usp.br
Maria Trocan, ENST, France, trocan@tsi.enst.fr
Wei-Ho Tsai, National Taipei University of Technology, Taiwan, whtsai@ntut.edu.tw
Shiao-Li Tsao, National Chiao Tung University, Taiwan, sltsao@cs.nctu.edu.tw
Belle Tseng, NEC Labs America, USA, belle@sv.nec-labs.com
Georg Turban, Darmstadt University of Technology, Germany, gturban@gmx.net
Matthew Turk, University of California, Santa Barbara, USA, mturk@cs.ucsb.edu
Peter Ungsunan, Tsinghua University, P.R. China, peterungsunan@hotmail.com
David Vallet, Universidad Aut�noma de Madrid, Spain, David.vallet@uam.es
Rik Van de Walle, Ghent University - IBBT, Belgium, rik.vandewalle@ugent.be
C. Gregor van den Boogaart, University of Augsburg, Germany, boogaart@informatik.uni-augsburg.de
Socrates Varakliotis, University College London, United Kingdom, S.Varakliotis@cs.ucl.ac.uk
Avinash Varna, University of Maryland, College Park, USA, varna@umd.edu
Akshay Vashist, NEC Labs, USA, vashist@nec-labs.com
Yuri Vatis, Leibniz Universit�t Hannover, Germany, vatis@tnt.uni-hannover.de
Vijay Venkataraman, Oklahoma State University, USA, vj2181@yahoo.com
Jan Erik Voldhaug, Norwegian University of Science and Technology (NTNU), Norway, voldhaug@q2s.ntnu.no
Stefan Wabnik, Fraunhofer IDMT, Germany, wbk@idmt.fraunhofer.de
Jean-Paul Wagner, Ecole Polytechnique Federale de Lausanne (EPFL), Switzerland, jean-paul.wagner@epfl.ch
Kongwah Wan, Institute for Infocomm Research, Singapore, kongwah@i2r.a-star.edu.sg
George Wang, CSUN, USA, twang@csun.edu
Honggang Wang, Univ of Nebraska Lincoln, USA, hwang@unlnotes.unl.edu
Hsin-Min Wang, Academia Sinica, Taiwan, whm@iis.sinica.edu.tw
Jinjun Wang, NEC Laboratories America, Inc., USA, jjwang@sv.nec-labs.com
Jinqiao Wang, Institute of Automation(IA) Chinese Academy of Sciences(CAS), P.R. China, jqwang@nlpr.ia.ac.cn
Ju Wang, Virginia Commonwealth University, USA, jwang3@vcu.edu
Patrick Wang, Northeastern University, USA, pwang@ccs.neu.edu
Tai Wang, Huazhong University of Science and Technology, P.R. China, wang.tai@163.com
Xiaohan Wang, McMaster University, Canada, xhwang@grads.ece.mcmaster.ca
Xin Wang, ContentGuard, Inc., USA, xin.wang@contentguard.com
Yao Wang, Polytechnic University, USA, yao@vision.poly.edu
Ye Wang, National University of Singapore, Singapore, wangye@comp.nus.edu.sg
Yuan-Fang Wang, University of California, USA, yfwang@cs.ucsb.edu
Zhou Wang, Univ. Texas at Arlington, USA, zhouwang@uta.edu
Hans Weda, Philips Research Europe, The Netherlands, hans.weda@philips.com
Xiaohui Wei, University of Texas at Arlington, USA, xhwei@cse.uta.edu
Axel Weissenfeld, Leibniz Universit�t Hannover, Germany, aweissen@tnt.uni-hannover.de
Dunwei (Grant) Wen, Athabasca University, Canada, dunweiw@athabascau.ca
Mathias Wien, Univ. Aachen, Germany, wien@ient.rwth-aachen.de
Andy Wilson, Microsoft Research, USA, awilson@microsoft.com
Kevin Wilson, MERL, USA, wilson@merl.com
Lars Wolf, TU Braunschweig, IBR, Germany, wolf@ibr.cs.tu-bs.de
Wayne Wolf, Princeton University, USA, wolf@princeton.edu
Edward Wong, Polytechnic University, USA, wong@poly.edu
Peter Hon Wah Wong, Hong Kong University of Science & Technology, Hong Kong, peterwong@ieee.org
Tien-Tsin Wong, The Chinese University of Hong Kong, Hong Kong, ttwong@cse.cuhk.edu.hk
Marcel Worring, University of Amsterdam, The Netherlands, worring@science.uva.nl
Chuan Wu, University of Toronto, Canada, chuanwu@eecg.toronto.edu
Chung-Hsien Wu, National Cheng Kung University, Taiwan, chwu@csie.ncku.edu.tw
Dajun Wu, Institute for Infocomm Research, Singapore, djwu@i2r.a-star.edu.sg
Di Wu, Linkoping University, Sweden, diwu@isy.liu.se
Feng Wu, Microsoft Research Asia, P.R. China, fengwu@microsoft.com
Gang Wu, University of California - Santa Barbara, USA, gwu@engineering.ucsb.edu
Guixing Wu, Research In Motion, Canada, g2wu@bbcr.uwaterloo.ca
Ja-Ling Wu, National Taiwan University, Taiwan, wjl@cmlab.csie.ntu.edu.tw
Jonathan Wu, University of Windsor, Canada, jwu@uwindsor.ca
Tao Wu, Nokia, USA, tao.a.wu@nokia.com
Xiao Wu, City University of Hong Kong, Hong Kong, wuxiao@cs.cityu.edu.hk
Xiaolin Wu, McMaster University, Canada, xwu@ece.mcmaster.ca
Yi Wu, Intel Corporation, USA, yi.y.wu@intel.com
Yi Wu, University of California, Santa Barbara, USA, wuyi@ece.ucsb.edu
Yihong Wu, Chinese Academy of Sciences, P.R. China, yhwu@nlpr.ia.ac.cn
Ying Wu, Northwestern University, USA, yingwu@ece.northwestern.edu
Yunnan Wu, Microsoft Research, USA, yunnanwu@microsoft.com
Zhenyu Wu, Thomson Inc, USA, zhenyu.wu@thomson.net
Shiming Xiang, Institute of Automation, Chinese Academy of Sciences, P.R. China, smxiang@cbsr.ia.ac.cn
Xin Xiao, Tsinghua University, P.R. China, xiaoxin00@mails.tsinghua.edu.cn
Lexing Xie, IBM Research, USA, xlx@us.ibm.com
Shoulie Xie, Institute for Infocomm Research, Singapore, slxie@i2r.a-star.edu.sg
Xiaodong Xie, JDL, P.R. China, xdxie@jdl.ac.cn
Hongkai Xiong, Shanghai Jiaotong University, P.R. China, xionghongkai@sjtu.edu.cn
Zixiang Xiong, Texas A&M University, USA, zx@ee.tamu.edu
Bo Xu, University of Illinois at Chicago, USA, boxu@cs.uic.edu
Changsheng Xu, Institute for Infocomm Research, Singapore, xucs@i2r.a-star.edu.sg
Chao Xu, Peking University, P.R. China, xuchao@cis.pku.edu.cn
Dong Xu, Columbia University, USA, dongxu@ee.columbia.edu
Huaxin Xu, National University of Singapore, Singapore, xuhuaxin@comp.nus.edu.sg
Yuning Xu, University of Texas at San Antonio, USA, yxu@cs.utsa.edu
Yuan Xue, Vanderbilt University, USA, yuan.xue@vanderbilt.edu
Charles Yaacoub, Holy-Spirit University of Kaslik, Lebanon, charlesyaacoub@usek.edu.lb
Rong Yan, IBM TJ Watson Research Center, USA, yanr@us.ibm.com
Shuicheng Yan, University of Illinois at Urbana-Champaign, USA, scyan@ifp.uiuc.edu
Weiqi Yan, National University of Singapore, Singapore, yanwq@comp.nus.edu.sg
WeiQi Yan, UC Irvine, USA, wyan@ics.uci.edu
Chun-Chuan Yang, National Chi-Nan University, Taiwan, ccyang@csie.ncnu.edu.tw
Hua Yang, Corporate Research, Thomson Inc., USA, hua.yang2@thomson.net
Jie Yang, Carnegie Mellon University, USA, yang+@cs.cmu.edu
Jun Yang, Carnegie Mellon University, USA, juny@cs.cmu.edu
Kemeng Yang, Monash University, Australia, kemeng.yang@infotech.monash.edu.au
Linjun Yang, Microsoft Research Asia, P.R. China, linjuny@microsoft.com
Ming Yang, Jacksonville State University, USA, myang@jsu.edu
Ming-Hsuan Yang, Honda Research Institute USA, inc, USA, myang@honda-ri.com
Peng Yang, Rutgers University, USA, yangpengict@gmail.com
Xiaokang Yang, Shanghai Jaoton University, P.R. China, xkyang@sjtu.edu.cn
Jian Yao, State University of NY at Binghamton, USA, jyao@binghamton.edu
Kim Hui Yap, Nanyang Technological University, Singapore, ekhyap@ntu.edu.sg
Sehoon Yea, MERL, USA, yea@merl.com
Hangu Yeo, IBM, USA, hangu@us.ibm.com
Ping Yes, IMAX Corp., Canada, pye@imax.com
Peng Yin, Thomson multimedia Inc., USA, peng.yin@thomson.net
Chen Yong-Sheng, National Chiao Tung University, Taiwan, yschen@cs.nctu.edu.tw
Changhuai You, Institute for Infocomm Research, Singapore, echyou@i2r.a-star.edu.sg
Heather Yu, Huawei Technologies (USA), USA, heathery@ieee.org
Jie Yu, University of Texas at San Antonio, USA, jyu@cs.utsa.edu
Rongshan Yu, Dolby Laboratories, USA, rzyu@dolby.com
Tianli Yu, Motorola Labs., USA, tianli.yu@motorola.com
Xinguo Yu, Institute for Infocomm Research, Singapore, xinguo@i2r.a-star.edu.sg
Shengli Yuan, University of Houston - Downtown, USA, yuans@uhd.edu
Xiaotong Yuan, NLPR, P.R. China, xtyuan@nlpr.ia.ac.cn
Yuan YUAN, Aston University, United Kingdom, y.yuan1@gmail.com
Yuan Yuan, Microsoft Research, USA, t-yyuan@microsoft.com
Lyubomir Zagorchev, Philips Research North America,, USA, Lyubomir.Zagorchev@philips.com
Bing Zeng, The Hong Kong University of Science and Technology, Hong Kong, eezeng@ee.ust.hk
Wenjun Zeng, Univ. of Missouri, Columbia, USA, zengw@missouri.edu
Zhihong Zeng, University of Illinois at Urbana-Champaign, USA, zhzeng@ifp.uiuc.edu
Hongbin Zha, Peking University, P.R. China, zha@cis.pku.edu.cn
Fan Zhai, Texas Instruments, USA, fzhai@ti.com
Yinwei Zhan, Guangdong Univ. of Technology, P.R. China, ywzhan@gdut.edu.cn
Cha Zhang, Microsoft Research, USA, chazhang@microsoft.com
Chengcui Zhang, University of Alabama at Birmingham, USA, zhang@cis.uab.edu
Dong Zhang, IDIAP research institute, Switzerland, zhang@idiap.ch
Hui Zhang, Tsinghua University, P.R. China, zhanghui04@mails.tsinghua.edu.cn
Jiankang Zhang, McMaster University, Canada, jkzhang@mail.ece.mcmaster.ca
Lei Zhang, Microsoft Research Asia, P.R. China, leizhang@microsoft.com
Lei Zhang, The Hong Kong Polytechnic University, Hong Kong, cslzhang@comp.polyu.edu.hk
Li Zhang, , P.R. China, chinazhangli@mail.tsinghua.edu.cn
Lun Zhang, Institute of Automation Chinese Academy of Sciences, P.R. China, lzhang@nlpr.ia.ac.cn
Ning Zhang, McMaster University, Canada, ningzhang@ece.mcmaster.ca
Tong Zhang, Hewlett-Packard Laboratories, USA, tong.zhang@hp.com
Xiangjun Zhang, McMaster University, Canada, zhangxj@grads.ece.mcmaster.ca
Xiao-Ping Zhang, Ryerson University, Canada, xzhang@ee.ryerson.ca
Xin Zhang, Oklahoma State University, USA, xin.zhang@okstate.edu
Zhi Zhang, Colorado State University, USA, zhang@engr.colostate.edu
Zhishou Zhang, Institute for Infocomm Research, Singapore, zszhang@i2r.a-star.edu.sg
Zhongfei Zhang, State University of New York at Binghamton, USA, zhongfei@cs.binghamton.edu
Guoying Zhao, University of Oulu, Finland, gyzhao@ee.oulu.fi
Jiying Zhao, University of Ottawa, Canada, jyzhao@site.uottawa.ca
Ling Zhao, Beihang University, P.R. China, zhaoling@ee.buaa.edu.cn
Zhao Zhao, Institute of Computing Technology, CAS, P.R. China, zzhao@jdl.ac.cn
Zhijie Zhao, Leibniz Universit�t Hannover, Germany, zhao@tnt.uni-hannover.de
Guifeng Zheng, HKUST, Hong Kong, gfzheng@cse.ust.hk
Nengheng Zheng, The Chinese University of Hong Kong, Hong Kong, nhzheng@ee.cuhk.edu.hk
Yan-Tao Zheng, National University of Singapore, Singapore, yantaozheng@comp.nus.edu.sg
Yefeng Zheng, Siemens Corporate Research (Princeton, NJ), USA, zhengyf@cfar.umd.edu
Chunguang Zhou, Jilin University, P.R. China, cgzhou@jlu.edu.cn
Howard Zhou, Georgia Tech, USA, howardz@cc.gatech.edu
Lifeng Zhou, National University of Singapore, Singapore, zhoulife@comp.nus.edu.sg
Bin Zhu, Microsoft Research China, P.R. China, binzhu@microsoft.com
Ce Zhu, Nanyang Technological University, Singapore, eczhu@ntu.edu.sg
Deqi Zhu, Apache Design, USA, deqi@apache-da.com
Donglai Zhu, Institute for Infocomm Research, Singapore, dzhu@i2r.a-star.edu.sg
Guangyu Zhu, Harbin Institute of Technology, P.R. China, gyzhu@jdl.ac.cn
Shangming Zhu, University of Missouri-Columbia, USA, zhusm@ecust.edu.cn
Yongwei Zhu, Institute for Infocomm Research, Singapore, ywzhu@i2r.a-star.edu.sg
Zhen Bo Zhu, IBM China Research Laboratory, P.R. China, zhuzb@cn.ibm.com
Li Zhuo, Beijing University of Technology, P.R. China, zhuoli@it.usyd.edu.au
Lawrence Zitnick, Microsoft Research, USA, larryz@microsoft.com
Bas Zoetekouw, Philips Research Europe, The Netherlands, bas.zoetekouw@philips.com
Dekun Zou, Thomson, USA, dekun.zou@thomson.net